2015 Frontiers of Characterization and Metrology for Nanoelectronics
April 14-16, 2015
Hilton Dresden, An der Frauenkirche 5, 01067 Dresden, Germany
The semiconductor industry faces significant challenges to continue increasing performance and functionality of information processing. New and improved metrology and characterization is required to support these advances in density and functionality. We bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, and manufacturing.
All approaches are welcome: chemical, physical, electrical, optical, in-situ, and real-time control and monitoring. The conference summarizes major issues and provides critical reviews of important semiconductor techniques needed as the semiconductor industry moves to silicon nanoelectronics and beyond.
Contact: Ehrenfried Zschech, firstname.lastname@example.org, +49 351 463 41093
For More Information: http://www.nist.gov/pml/div683/conference/
Travel information: Download here
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To Register Online: click here
To Register via Fax or email (PDF form version):
Please fax your booking to +49 341 23689933 or send an Email to FCMN2015@innotec21.de.
After receiving the registration for the FCMN 2015 the Conference Management (InnoTec21 GmbH, Leipzig, Germany) will provide an invoice.
click here to download the offline registration form.
All Attendees must register and receive a conference badge in order to participate in conference activities.
Registration is required for all participants of FCMN 2015. It will allow you to:
- attend the three days of the conference (keynotes, panels)
- join all meals during the conference (lunches and coffee breaks)
- take part in the official reception/wine and cheese party/dinner event (except day-ticket-owner)
- access the projects exhibit floor
- evaluate on-site your favourite project in the poster session
All information for cancellations are given in the Terms and Conditions of Registration and Attendance.
Mail or Fax Completed Registration Form & Payment To:
Mrs. Elke Goering
Gohliser Str. 13
Phone: +49 341 2368990
Fax: +49 341 236 899 33
|Before March 1st, 2015||430 € (VAT excl.)|
|After March 1st, 2015||520 € (VAT excl.)|
|Students only||190 € (VAT excl.)|
|April, 14th 2015 (FCMN)||190 € (VAT excl.)|
|April, 15th 2015 (FCMN)||190 € (VAT excl.)|
|April, 16th 2015 (FCMN + 3D Symposium)||190 € (VAT excl.)|
Registration for these events is only necessary if you are purchasing a One-Day ticket. The social events are already included in the General Registration.
|Banquet (April, 15th 2015)||60 € (VAT excl.)|
|Cheese & Wine Party (April, 14th 2015)||60 € (VAT excl.)|
VAT: All fees listed exclude 19% (VAT). All fees will be collected in Euros.
Are you interested to use the several opportunities of sponsoring please book here.
Platinum Package: 4.000 €
Benefits: Two free registrations, exhibit space near the poster session for duration of conference, high-level visibility at the conference website (logo-link, company and product profile) plus a full-page ad in the program/abstract book.
Gold Package: 3.000 €
Benefits: One free registration, high-level visibility at the conference website (logo-link, company and product profile) plus a half-page ad in the program/abstract book.
Silver Package: 2.000 €
Benefits: Company name and link listed on the conference website plus a quarter-page ad in the program/abstract book. Exhibitor: 1.500 €* Benefits: Exhibit space near the poster session for duration of conference, company name and link listed on the conference website plus a quarter-page ad in the program/abstract book.
*Note, the exhibit space fee includes the space only. Booth staff, unless registered separately, will be badge only and not permitted to attend talks, meals, or events.
- Symposium 3D Integration – Technology, Materials, Reliability – APRIL 16th, 2015
We would like to invite you to attend the Symposium “3D Integration – Technology, Materials, Reliability”. This symposium will provide a forum for presenting current research and for discussions on issues related to technology, materials, reliability and characterization for 3D integration, including its applications for novel products.
- 3rd Dresden Nanoanalysis Symposium on April 17, 2015 at Technical University of Dresden.
Registration is available under the link: www.tu-dresden.de/dcn/3rd-dns